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              About Nanya

              About Nanya

              Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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              News

              News

              Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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              Talent recruitment

              Talent recruitment

              Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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              Contact Us

              Contact Us

              Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

              Detail
              TAK-10C fully automatic chip inserting machine

              Product Introduction

              The 10C fully automatic silicon wafer insertion machine is a new type of fully automated equipment independently developed and developed by a South Asian company based on the development and market demand of the photovoltaic industry and the international semiconductor industry. Reliable automatic loading can be achieved through CNC devices, with functions such as chain protection, working condition display, and fault alarm.

              This equipment is mainly used for automatic packaging of products with similar shapes such as silicon wafers and solar cells before cleaning.

              Performance and technical parameters
              Process characteristics
              Control system
              Fragment detection system
              Layout Plan of Insertion Machine
              Main component configuration
              Technical support and service requirements

              Edge collapse rate: ≤ 0.3% (caused by equipment itself, excluding silicon wafer quality issues and other equipment impacts);

              Fragmentation rate: ≤ 0.2% (caused by equipment itself, excluding silicon wafer quality issues and other equipment impacts;

              Hidden crack rate: ≤ 0.2% (caused by the equipment itself, excluding silicon wafer quality issues and other equipment effects);

              Adapting to silicon wafers: whole silicon wafers

              ① Silicon wafer type: single crystal silicon wafer

              ② Silicon wafer size: 166~230mm compatible, loading capacity of loading fixture ≥ 800 pieces, 182/210mm (compatible) fixture provided by the equipment manufacturer (4 pieces per machine), without additional charge.

              Note: There is no compatibility between the full chip model and the half chip model

              ③ Silicon wafer thickness: 90 μ m ---220 μ m

              ④ Applicable cleaning basket: Both parties shall determine the form and overall dimensions of the flower basket in advance.

              ⑤ Capacity: 166~182mm ≥ 8300

              210mm≥7500

              230mm ≥ 7000 pieces/hour.

              Control system: PLC programmable controller, AC servo system.

              Fragment detection system: detects fragments, missing corners, and laminations and automatically removes them.

              Air source flow rate: Inlet pipe diameter ≥ 10mm and cleaning machine interface: The wafer basket filled with silicon wafers is automatically and smoothly grabbed and cleaned through the built-in mechanical arm or device

              Machine flipping turntable, process without human intervention.

              Continuous working time: capable of working continuously for 24 hours

              Power supply: AC220V (single-phase three wire), 50HZ

              Equipment power: 7.0KW

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