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              About Nanya

              About Nanya

              Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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              News

              News

              Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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              Talent recruitment

              Talent recruitment

              Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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              Contact Us

              Contact Us

              Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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              Large capacity continuous stripping and washing integrated machine

              Product Introduction

              The TAC-TCQ10K continuous debonding and insertion integrated machine is an intelligent device designed specifically for the photovoltaic industry. This device can achieve automatic debonding, continuous feeding, and fully automatic insertion of silicon wafers, without the need for manual handling. This equipment has the characteristics of high production efficiency, high yield, low labor cost, and production risk. It is suitable for various specifications of silicon wafers. The insertion program and process can be freely adjusted according to actual needs, and is equipped with functions such as chain protection, working condition display, and fault alarm.

              Performance and technical parameters
              Process characteristics
              Control system
              Fragment detection system
              Layout Plan of Insertion Machine
              Main component configuration
              Technical support and service requirements

              1. Overall specification of the degumming insert cleaning integrated machine: 31800L × 3200W × 3200H(mm)

              2. Fragmentation rate: ≤ 2 ‰ (caused by equipment itself; excluding incoming material issues and other equipment impacts)

              3. Collapse rate: ≤ 5 ‰ (caused by equipment itself; excluding incoming material issues and other equipment impacts)

              4. Lamination rate: ≤ 1 ‰ (only the number of laminations inserted into the flower basket is calculated; excluding the impact of incoming materials and other equipment)

              5. Production capacity: ≥ 13000 pieces/hour (182mm silicon wafer); ≥ 10000 pieces/hour (210mm silicon wafer)

              6. Suitable for silicon wafers: ① Types of silicon wafers: monocrystalline silicon wafers, polycrystalline silicon wafers

              ② Silicon wafer size: 182mm ± 0.5mm, 210mm ± 0.5mm, 230mm ± 0.5mm

              ③ Silicon wafer thickness: 120 μ m---180 μ m

              ④ Left and right directionality: matching the operation directionality with the cleaning machine

              ⑤ Applicable cleaning baskets: 100, 104, 113, 120 flower baskets

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